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Wewynn Provides Comprehensive Thermal and Energy-Efficient Solutions for Data Centers
"In data centers, the less electric consumption from IT system cooling, the higher energy efficiency, and lower PUE data centers can reach.
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CIO Applications | Thursday, November 03, 2022

Data centers can increase their power density by lowering the power to units (PUE) of their IT equipment and increasing the density of their racks.
FREMONT, CA: "In data centers, the less electric consumption from IT system cooling, the higher energy efficiency, and lower PUE data centers can reach. Wiwynn's thermal expertise in air and liquid cooling, from system to rack and tank level, has helped data centers optimize their thermal efficiency effectively. We are looking forward to contributing to the development of sustainable data centers and the challenge of the high-power density era," said Dr. Sunlai Chang, Wiwynn's President.
Data center IT infrastructure provider Wiwynn unveiled its comprehensive thermal technologies at OCP Global Summit 2022, including air, cold-plate liquid, and 2-phase immersion cooling. This is the response to the growing demand for sustainable data centers and high power density from next-generation processors.
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An OCP Global Summit demo tank will show off Wiwynn's 2-phase immersion cooling technology. Its customized 2-phase immersion cooling solution, which includes servers, tanks, and integration, has demonstrated significant reductions in PUE for customers in hyperscale data centers. Wiwynn's new generation tank will soon adopt a new ultra-low GWP fluid for environmental protection.
Wiwynn will introduce its new cold-plate liquid cooling solution for OCP OAI servers in partnership with the OCP OAI Cooling Group. Wiwynn's thermal solutions are based on its deep knowledge of high-power systems. This increases energy efficiency as well as the power density of the system. Wiwynn also contributed to the open community with seven industry partners, the OCP OAI System Liquid Cooling guidelines for next-generation data centers.
The breakthrough chip-level liquid cooling technologies developed by Wiwynn will also be presented at OCP Future Technologies Symposium. Thermal efficiency is improved by integrating a cold plate with a chipset package. 3DIC technology has grown rapidly in recent years, making the proposed innovation better address the crucial challenge of IC power growth.
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